Impedances in parallel with the arc may be
either capacitors or resistors, or both, in various combinations. Although such
impedances modify the shape of the specified inherent transient recovery
voltage, the type and degree of modification in the synthetic test should be
the same as in the direct test.
For example, the insertion of a resistor
equal to the surge impedance of the line will reduce the line side rate-of-rise
to half value. The effect is not as pronounced for a bus fault where a large
number of lines are in parallel because their combined surge impedance is much
lower than the resistance in parallel with the arc.
Where the shunt impedance is a resistor,
particularly if the ohmic value of the resistor is low, the actual peak
transient recovery voltage (TRV) in a synthetic test may not attain the value
it would in a direct test because of the limited energy available from the
voltage source.
Furthermore, the shunt resistor may cause a
too rapid decay of the dc voltage following the TRV crest.
In some cases, to meet the TRV requirements
of ANSI/IEEE C37.09-1979 [3], it may be possible
1) To adjust the parameters of the voltage
circuit to provide the necessary additional energy absorbed by the shunt
resistor
2) To switch over to an additional ac
voltage source capable of maintaining voltage across the resistor.
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